高电子迁移率晶体管
碳化硅
MOSFET
氮化镓
晶体管
半导体器件建模
宽禁带半导体
计算机科学
电子工程
材料科学
算法
拓扑(电路)
光电子学
电气工程
工程类
CMOS芯片
纳米技术
电压
冶金
图层(电子)
作者
Long Xiao,Jun Zhao,Botao Zhang,Dongdong Chen,Wu Liang
标识
DOI:10.1109/tie.2020.3026283
摘要
This article has presented a unified electrothermal behavior modeling method for both silicon carbide (SiC) metal oxide semiconductor field effect transistor ( mosfet ) and gallium nitride (GaN) high electron mobility transistor (HEMT). The electrothemal behavior of these two kind of devices in both the first and the third quadrant is accurately modeled with serval compact equations. A modeling data and optimization algorithm-based parameter extraction method have been proposed to replace the previous time consuming and labor intensive one. The proposed parameter fitting algorithm is a genetic algorithm and Levenberg–Marquardt combined optimization algorithm possessing the advantages of global optimization and fast convergence speed, and modeling data can come from both datasheets and measurement. The correctness and accuracy of the proposed modeling method has been verified by simulation and experiment result. Meanwhile, it has been proved that the proposed modeling method is applicable to several commercially available SiC mosfet s and GaN HEMTs.
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