期刊:Optical Fiber Communication Conference日期:2019-03-03卷期号:: 1-3被引量:2
标识
DOI:10.1364/ofc.2019.tu2i.1
摘要
A 4-channel wire-bond-free 3D-stacked transmitter module consisting of a 65-nm CMOS cascode shunt LD driver, 1.3-μm LD-array-on-Si, and LTCC interposer achieves simultaneous 4-channel 25-Gbps error-free transmission over 1.2-km-long SSMF, with power consumption of 2.67 mW/Gbps.