Research on the influence of heat treatment on residual stress of TC4 alloy produced by laser additive manufacturing based on laser ultrasonic technique

残余应力 材料科学 压力(语言学) 超声波传感器 复合材料 激光器 光学 声学 哲学 语言学 物理
作者
Yu Zhan,Hexuan Xu,Wenqiang Du,Changsheng Liu
出处
期刊:Ultrasonics [Elsevier BV]
卷期号:115: 106466-106466 被引量:49
标识
DOI:10.1016/j.ultras.2021.106466
摘要

During the laser additive manufacturing (LAM) process large temperature gradients can lead to high level of residual stress. The residual stress can have irreversible effects such as warping and cracking of parts during and post manufacturing. Heat treatment is an effective method to control and eliminate residual stress. In this paper, the TC4 parts are prepared by laser additive manufacturing, and the influence of heat treatment process on residual stress is researched. Laser ultrasonic technology, as an advanced nondestructive testing method, is applied to measure the residual stress under different heat treatment processes for the first time. The surface wave generated by laser is used to evaluate the residual stress. The results show that laser ultrasonic method can complete the in-situ evaluation of residual stress in additive manufacturing components. The residual stress in TC4 deposited specimen is large, the longitudinal stress is obviously greater than the transverse stress, and the maximum residual stress is about half of the yield strength. The residual stress increases gradually from the upper surface to the bottom layer near the substrate before heat treatment. After heat treatment, the residual stress is reduced to low stress level and a small compressive stress appears. The cooling rate and solution temperature are the main factors affecting the residual stress, and the residual stress increases with the increase of cooling rate and solution temperature. The effect of aging temperature and aging time on residual stress is not obvious. The study serves as useful guidelines for engineers to assessment and regulation of residual stress reasonably in LAM.
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