Self-packaged high-resolution liquid metal nano-patterns

•Laser interference lithography is invented for nano-patterning liquid metal (LM) •The resolution in LM patterns breaks the optical limit of laser beams •Pulsed-laser-induced compression enables uniform ∼500-nm LM nanolayers •The robust oxide shell on LM boosts the mechanical properties and reliability High-resolution self-packaged conductive patterns are important in integrated electronics used in harsh environments. One of the most promising candidates is gallium-based liquid due to its unique properties. Here, we introduce an advanced liquid metal nano-patterning technique based on pulsed laser lithography (PLL) to create self-packaged, high-resolution liquid metal patterns. The method described here, for the first time, can directly generate liquid metal nano-patterns with ∼500-nm line width without being limited by laser beam size. Line-scanning pulsed-laser-induced shock and thermal effects could generate compression on the liquid metal to extrude ∼200-nm particles to an ∼30-nm layer covered by an ∼20-nm oxide shell with boosted mechanical properties. When subjected to external damage, the electrical functionality of the nano-patterns is well maintained due to the protective self-packaged shell and its 3D structure. The electrically self-packaged material with high resolution is a promising candidate to serve in demanding applications with high integration densities. High-resolution self-packaged conductive patterns are important in integrated electronics used in harsh environments. One of the most promising candidates is gallium-based liquid due to its unique properties. Here, we introduce an advanced liquid metal nano-patterning technique based on pulsed laser lithography (PLL) to create self-packaged, high-resolution liquid metal patterns. The method described here, for the first time, can directly generate liquid metal nano-patterns with ∼500-nm line width without being limited by laser beam size. Line-scanning pulsed-laser-induced shock and thermal effects could generate compression on the liquid metal to extrude ∼200-nm particles to an ∼30-nm layer covered by an ∼20-nm oxide shell with boosted mechanical properties. When subjected to external damage, the electrical functionality of the nano-patterns is well maintained due to the protective self-packaged shell and its 3D structure. The electrically self-packaged material with high resolution is a promising candidate to serve in demanding applications with high integration densities.