材料科学
热电效应
结晶度
掺杂剂
柔性电子器件
薄膜
兴奋剂
光电子学
极限抗拉强度
复合材料
热电材料
纳米技术
热导率
物理
热力学
作者
Athorn Vora–ud,Anh Tuấn Thanh Phạm,Dai Cao Truong,Somporn Thoawankeaw,Hoa Thi Lai,Thu Bao Nguyen Le,Nhat Quang Minh Tran,Mekhala Insawang,Pennapa Muthitamongkol,Mati Horprathum,Manish Kumar,Sungkyun Park,G. Jeffrey Snyder,Tosawat Seetawan,Thắng Bách Phan
标识
DOI:10.1016/j.cej.2023.142954
摘要
Transparent-flexible thermoelectric thin films have immense potential as power supplies for future small-sized consumer electronics, the internet of things, and wearable devices. Here, we report the thermoelectric properties of dual Ga and In doped ZnO films (IGZO) deposited on a polyimide substrate with post-thermal treatment in vacuum along with fabricating 4-unileg flexible IGZO thermoelectric devices. All the as-deposited and annealed IGZO films are the preferred (0 0 2) orientation and under tensile stress. The post-thermal treatment controls the dopant substitution/diffusion in the host ZnO lattice affecting the film crystallinity, residual stress, and thermoelectric properties. Among the films, the IGZO film annealed at 250 °C has the best power factor of 16.9 μWm−1K−2 with the largest crystal size, lowest tensile stress, highest carrier concentration, and lowest density-of-state effective mass. The practical application of flexible IGZO films was also reported via a 4-unileg-IGZO films thermoelectric module, which achieved an output power about 3.2 nW at ΔT = 120 K.
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