Interfacial Imc Growth Behavior of Sn-3ag-3sb-Xin Solder on Cu Substrate

The growth of solder joint interface layer is closely related to the reliability of solder joints. In this work, the growth behavior of the interfacial intermetallic compounds layer between Sn-3Ag-3Sb-xIn/Cu (x=0, 1, 2, 3, 4, 5 wt.%) solder joints and commercial Sn-3Ag-0.5Cu/Cu solder joint was compared during 125 ℃ isothermal aging. The results indicate that more InSb particles are observed in Sn-3Ag-3Sb-xIn/Cu solder joints when the In content exceeds 3 wt.%. The InSb particles form an interfacial barrier that reduces the growth rate of the total intermetallic layer. Meanwhile, the growth rate of the Cu3Sn layer decreases significantly. Our research provides a solution to inhibit the growth of the interface intermetallic layer and further provides valuable help for improving the reliability of solder joints.