Effects of activation method and temperature to III-nitride micro-light-emitting diodes with tunnel junction contacts grown by metalorganic chemical vapor deposition

化学气相沉积 金属有机气相外延 发光二极管 光电子学 材料科学 电致发光 二极管 活化能 量子效率 化学 纳米技术 外延 有机化学 图层(电子)
作者
Matthew S. Wong,Nathan Palmquist,Jiaxiang Jiang,Philip Chan,Changmin Lee,Panpan Li,Ji Hun Kang,Yong Hyun Baek,Chae Hon Kim,Daniel A. Cohen,Tal Margalith,James S. Speck,Shuji Nakamura,Steven P. DenBaars
出处
期刊:Applied Physics Letters [American Institute of Physics]
卷期号:119 (20) 被引量:8
标识
DOI:10.1063/5.0073629
摘要

The optical and electrical characteristics of InGaN blue and green micro-light-emitting diodes (μLEDs) with GaN tunnel junction (TJ) contacts grown by metalorganic chemical vapor deposition (MOCVD) were compared at different activation temperatures among three activation methods from the literature, namely, sidewall activation, selective area growth (SAG), and chemical treatment before sidewall activation. The devices with chemical treatment before activation resulted in uniform electroluminescence and higher light output power, compared to the devices with sidewall activation and SAG. Moreover, the green μLEDs showed greater optical degradation at elevated activation temperatures, whereas the blue μLEDs yielded trivial difference with activation temperatures from 670 to 790 °C. The 5 × 5 μm2 devices with chemical treatment before activation and SAG yielded almost identical voltage at 20 A/cm2, and the voltage penalty significantly decreased with activation temperature in the case of devices with sidewall activation. The devices with chemical treatment before activation resulted in higher external quantum efficiency (EQE) and wall-plug efficiency (WPE) in low current density range compared to the devices with SAG. The enhancements in EQE and WPE were observed in different μLED sizes, suggesting that chemical treatment before sidewall activation enables the use of TJ contacts grown by MOCVD and is advantageous for applications that require high brightness and efficiency.

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