数码产品
材料科学
执行机构
智能材料
汽车工业
纳米技术
共形矩阵
制造工程
电气工程
工程类
复合材料
航空航天工程
作者
Georgina E. K. K. Seah,Zhi Yuan Lee,Ai Wei Gan,Xin Jiang,Sirin Kamarulzaman,Jing Yu,Shermin S. Goh
标识
DOI:10.1002/adfm.202421060
摘要
Abstract The flexible electronics market is rapidly growing, driven by demand in the healthcare, automotive, and consumer industries. While these technologies enhance the daily lives, the electronic waste (e‐waste) generated in tandem poses significant environmental challenges. Covalent adaptable networks (CANs) are crosslinked polymers bearing dynamic covalent bonds (DCBs). These exchangeable bonds endow CANs not only with the high mechanical and chemical stability of thermosets but also with the stimuli‐activated reprocessability of thermoplastics. CAN‐derived electronics offer a solution to alleviate e‐waste generation since the DCBs allow for the self‐healing and recycling of these devices. Additionally, the ability of CANs to respond to stimuli is highly desirable for smart materials, especially flexible electronics. In this review, how CANs play the role of conformable substrates and dielectrics, and also as flexible electronic connectors, sensors, and actuators is comprehensively cataloged. Furthermore, the advantages gained by utilizing CANs in electronic sensors and actuators is highlighted, as well as provide the insights into design strategies to address the challenges of creating high‐performance sustainable soft electronics.
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