Wafer‐Scale Dry‐Transfer of Single‐Crystalline Transition Metal Dichalcogenides

is demonstrated, with structural, electrical, and optical properties comparable to those of the bulk counterpart. Furthermore, the approach is fully compatible with standard semiconductor fabrication workflows and equipment, offering a scalable pathway for automated high-throughput fabrication. This findings provide a new avenue for the large-scale production of multi-stacked materials and twist-electronic device arrays.