Terabit‐Per‐Second Multidimensional Multiplexing Photonic Integrated Circuit in Lithium Niobate on Insulator

Abstract The surge in data driven by socio‐economic development has presented enormous challenges to data centers, catalyzing the swift advancement of optical interconnect technology. Advanced optical multiplexers and modulators are increasingly applied to optical interconnects in data centers, offering robust solutions to mitigate the impact of this data deluge. In this paper, a multidimensional multiplexing photonic integrated circuit in lithium niobate on an insulator is proposed and demonstrated involving hybrid multiplexing technology in wavelength, polarization, and mode dimensions. Moreover, the integration of eight racetrack‐resonator modulators with the multidimensional multiplexer is achieved successfully, enabling high‐speed data transmission at a rate of 0.96 Tbps (8 × 120 Gbps). The fabricated photonic integrated circuit is expected to meet the escalating demands of future data‐intensive applications with a scalable and high‐performance solution.