材料科学
退火(玻璃)
热的
压力(语言学)
石英玻璃
复合材料
热力学
物理
语言学
哲学
作者
S.Y. Yin,Chengshuai Li,Haisheng Fang,Qianli Ma
标识
DOI:10.1016/j.jnoncrysol.2024.122857
摘要
High-temperature two-step chemical vapor deposition (CVD) is a promising method of preparing large-scale silica glass, in which thermal stress is generated due to uneven temperature distribution when cooling naturally to room temperature. In this paper, a numerical model of the annealing and cooling processes has been established to study the generation and evolution of thermal stress. Furthermore, the annealing parameters, including annealing temperature and annealing time, are investigated to control thermal stress. The simulation results proved that variations in annealing temperature and annealing time can significantly affect the thermal stress generated during the annealing and cooling process. The residual stress decreases with increasing annealing temperature and annealing time. To optimize the annealing process, two-step annealing, including higher and lower temperature stages, has been studied. It is found that stepwise annealing can reduce the residual stress and the stress peaks with a shorter annealing time in the high-temperature stage.
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