An Efficient MEMS Microelectrode Array with Reliable Interelectrode Insulation Processes for In Vivo Neural Recording

Abstract Microelectrode arrays, particularly Utah arrays, offer irreplaceable advantages in clinical applications and play a crucial role in advancing brain‐computer interactions. However, the glass‐fused monolithic structure of Utah arrays limits functional expansion, and the glass insulation process is complex, costly, and time‐intensive. This paper presents a microelectrode array with a simple and time‐saving fabrication process, utilizing low‐resistance silicon and borosilicate glass wafers as electrodes and insulation substrates, respectively. The utilization of the anodic bonding process improves production efficiency and enhances process compatibility. A one‐step static wet etching process is used to form microneedle morphology to further simplify the fabrication process. Sputtered iridium oxide, as the electrode interface material, significantly reduces electrochemical impedance, and cellular experiments have confirmed its non‐cytotoxicity. Moreover, the implantation into the primary visual cortex of mice has demonstrated the ability of the electrode to record in vivo electrical signals within 15 days. Movement trajectory experiments demonstrate that the mice exhibit good behavior activities following electrode implantation. The bonded microelectrode array (BMEA) presented in this work provides a universal and effective tool for neural recording, with prospective applications in multi‐physiological monitoring and microelectromechanical system integration.