Warpage Analysis of Silicon Wafer in Ingot Slicing by Wire-Saw Machine

It is possible thermal expansion from heat generation by slicing deforms a single‐crystal silicon ingot but the authors can find no report on the point. In addition, numerical analysis is useful to clarify the mechanism of wafer warping but no paper has been reported the numerical analysis from the start to end of the wafer slicing process. The authors carried out experiments for the wafer slicing. In addition, a finite element analysis was carried out in order to solve the warping mechanism from the start to end of the wafer slicing process. The warp of wafer in the vertical direction was 6.05 μ m in the experiment whereas the warp in the finite element analysis was 5.30 μ m. The result by the finite element analysis gave good agreement with experimental one. This paper suggests that thermal expansion of the ingot has great influence on the warp of wafer.