CMOS芯片
碳化硅
材料科学
纳米技术
工程物理
光电子学
工程类
冶金
作者
Hui Wang,Pengyu Lai,Md Zahidul Islam,Abu Shahir Md Khalid Hasan,Anthony Di Mauro,Nur-E-Afra Anika,Robert D. Russell,Zhuowen Feng,Kevin Chen,Asif Faruque,Thomas P. White,Zhong Chen,H. Alan Mantooth
标识
DOI:10.1016/j.mssp.2024.108422
摘要
A comprehensive overview of the advancements, challenges, and prospects of silicon carbide (SiC) complementary metal-oxide-semiconductor (CMOS) technology is presented. As the demand for high-performance and energy-efficient electronic devices continues to grow, SiC has emerged as a promising material due to its unique properties. The paper aims to provide a thorough understanding of the state-of-the-art developments in SiC CMOS technology. The paper delves into the key features of SiC and its compatibility with CMOS processing techniques. It highlights the challenges associated with SiC CMOS technology, such as substrate quality, interface states, and process integration. Examples of CMOS circuitry that have been successfully designed, fabricated, and tested are provided.
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