薄脆饼
材料科学
线程(蛋白质序列)
位错
碳化硅
半径
凝聚态物理
基面
硅
结晶学
光电子学
复合材料
核磁共振
物理
蛋白质结构
化学
计算机科学
计算机安全
作者
Yi Chen,Ning Zhang,Xian Rong Huang,David R. Black,Michael Dudley
出处
期刊:Materials Science Forum
日期:2008-09-26
卷期号:600-603: 301-304
被引量:10
标识
DOI:10.4028/www.scientific.net/msf.600-603.301
摘要
The density and sense distribution of elementary threading screw dislocations in a physical vapor transport grown 3-inch 4H silicon carbide wafer have been studied. The density of TSDs ranges between 1.6×103/cm2 and 7.1×103/cm2 and the lowest density is observed at positions approximately half radius off the wafer center. The dislocation sense of elementary threading screw dislocations can be readily revealed by the asymmetric contrast of their images in grazing-incidence x-ray topographs using pyramidal plane reflections. The circumferential and radial distributions of the sense of elementary threading screw dislocations have been studied and no clear trends are observed in either distribution.
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