氰酸酯
氮化硼
材料科学
电介质
热导率
复合数
耗散因子
复合材料
介电损耗
热扩散率
制作
导电体
光电子学
物理
病理
医学
替代医学
量子力学
作者
Junwei Gu,Shuang Xu,Qiang Zhuang,Yusheng Tang,Jie Kong
标识
DOI:10.1109/tdei.2017.006299
摘要
In this paper, we presented a new strategy for fabrication of polymeric composites combined with low dielectric loss and desirable thermal conductivity. With the incorporation of hyperbranched polyborosilazane (hb-PBSZ) into bisphenol A cyanate ester (BADCy) matrix, the modified hb-PBSZ/BADCy resin with 4 wt% hb-PBSZ possessed a low dielectric constant (å) value of 2.37 and relatively low dielectric loss tangent value of 0.008 at 1MHz. Furthermore, by integrating micrometer boron nitride particles (mBN) into hb-PBSZ/BADCy matrix, the mBN/hb-PBSZ/BADCy composites presented relatively low å of 3.09, desirable thermally conductive coefficient (λ of 0.63 W/(m·K)) and thermal diffusivity (α of 0.42 mm2/s) values. It provides an important perspective for designing dielectric and thermally conductive polymeric composites for electrical packaging and energy storage fields.
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