Selective preparation of high-performance Cu metal micropatterns based on laser direct writing technology

In recent years, research interest has rapidly increased in the selective metallization of different substrate materials (flexible substrates and hard and brittle materials). Due to their unique optical and electrical properties, the fabrication of metal patterns on various substrate materials has a wide range of applications. These include micro-electro-mechanical systems, micro-heaters in micro-fluidic systems, electrodes for electronic devices and flexible wearable devices. However, the differences in the properties of the substrate materials themselves lead to poor adhesion of the metal micropatterns to their substrate materials, which is one of the main factors affecting the selective metallization of their surfaces. Therefore, a method for selective preparation of high-performance patterning is needed. Laser direct writing technology, as an emerging low-cost, high-efficiency and high-precision processing technology, can realize the preparation of fine metal selective patterning. This is significant for preparing optoelectronics and semiconductor micro/nanostructures and devices. This paper reviews the research progress related to the preparation of highperformance Cu metal micropatterning by laser direct writing, which mainly includes laser direct structuring, laserinduced selective activation, laser-induced selective reductive sintering of metal precursor nano-inks and laser-induced forward transfer. By reviewing the research of this group and the current related research results, the current research status of the preparation of selective metal patterning in different substrate materials is investigated and introduced from the fundamental mechanisms and process characteristics of the various methods. This paper can provide a reference for the research and application of high-performance Cu metal micropatterning prepared by laser direct writing. These high-performance metal micropatterns are useful for microcircuit defect repair, glass heating devices, and transparent atomization devices, which could be a potential option for various microsystems.