Silica nanofillers-reinforced polyimide composites for mechanical, thermal, and electrical insulation applications and recommendations: a review

聚酰亚胺 材料科学 复合材料 纳米复合材料 电介质 复合数 聚合物 保温 图层(电子) 光电子学
作者
V. E. Ogbonna,A.P.I. Popoola,Olawale Popoola
出处
期刊:Journal of physics [IOP Publishing]
卷期号:2368 (1): 012001-012001 被引量:3
标识
DOI:10.1088/1742-6596/2368/1/012001
摘要

Owing to the specific properties of polyimide, its nanocomposites have in recent years shown to be a promising polymer composite for mechanical, thermal, and electrical insulation applications. Studies have in many ways revealed the utilization of the polyimide reinforced nanofillers in the area of insulation practice be it thermal or electrical insulation. However, reinforced polyimide nanocomposites were observed to undergo interfacial bonding issues that have badly influenced their insulation behaviour during service. Dielectric properties and electrical discharge (corona discharge) resistance lifespan of polyimide composites are found degrading during long periods of exposure to elevated temperature conditions. Notwithstanding, efforts have been made on improving the electrical and thermal insulation behaviour of polyimide nanocomposites. As such, the current review study focused on the influence of silica nanoparticles on the thermal, electrical, and mechanical characteristics of polyimide matrix composites for insulation practice and applications. Thus, the vision of the authors is to contribute to the future trend of designing and processing polyimide nanocomposites for insulation applications. Thus, the authors ended the article with furtherance, challenges, and recommendations of further enhancement of polyimide nanocomposites as a candidate material for insulation (electrical and thermal). Hence, the study will pave the way for future studies.
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