碳化硅
宽禁带半导体
材料科学
氮化镓
半导体
功率半导体器件
光电子学
可靠性(半导体)
半导体器件
工程物理
硅
半导体材料
带隙
数码产品
电子工程
电压
纳米技术
功率(物理)
电气工程
工程类
物理
图层(电子)
量子力学
冶金
作者
Ranjeeta Patel,Babita Panda,Snehalika,Prajna Paramita Dash
标识
DOI:10.1109/peccon55017.2022.9851186
摘要
Recent developments are focusing more on advancement of Power semiconductor devices used in converters that uses Silicon (Si) materials. These Si materials have approached to their theoretical limits in terms of reliability, efficiency and voltage blocking capability that Si-based material cannot handle. To overcome this limitation, new semiconductor materials are employed to make the power electronics system more robust. Improved Semiconductor materials are considered as Wide Band-gap Semiconductors that includes silicon carbide (SiC) and gallium nitride (GaN) novel semiconductor material that replaced Si devices. This paper represents a comprehensive study of SiC and GaN devices based on different characteristics and its future trends.
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