A Low-Loss Slow Wave SIW Bandpass Filter With Blind via-Holes Using TGV Technology

In this letter, a compact and high-performance filter based on a single-layer slow wave substrate integrated waveguide (SW-SIW) is proposed. The topology integrates through vias and blind vias on a single-layer glass substrate using laser-induced wet etching (LIWE) through glass vias (TGVs) technology. Compared to the printed circuit board (PCB) process, the adopted TGV technology shows the advantages of high precision, high integration, and simplified process. Meanwhile, according to different application scenarios, LIWE TGV process can be used to prepare the proposed filters by selecting glass substrates with various properties. As an example, the proposed filter is simulated, fabricated, and measured based on low-loss quartz glass substrate. The simulated and measured results of the filter show an excellent correlation, indicating that the proposed filter using TGV technology has tremendous potential for applications in the millimeter-wave (mm-wave) band.