Novel Press-Pack Power Diode DBW3-3500 With Integrated Microchannel Cooling System

A power device junction temperature is a limiting factor influencing the electrical properties of the electronic element. This article presents a new power diode DBW3-3500 that is encapsulated in a novel press-pack package integrated with a microchannel cooling system. A comprehensive field tests covering the conventional solution of DB3-3500 diode (Kubara Lamina) with single-sided and double-sided water heat sinks and the new diodes with the embedded cooler are shown and discussed. Conducted measurements for the rated current of 3500 A confirmed that the new package even with single-side cooling solution allows reducing the junction temperature of about 40 °C in comparison with the conventional liquid cold plates. Hence, the improvement of electrical parameters is also observed. Predicted rated forward current reaches 5000 A. Furthermore, the novel solution offers a reduction of the weight and dimensions of the whole system.