材料科学
氮化硼
复合材料
复合数
柔性电子器件
热导率
导电体
各向异性
数码产品
纳米技术
光学
电气工程
物理
工程类
作者
Haeleen Hong,Yei Hwan Jung,Ju Seung Lee,Chanseok Jeong,Jong Uk Kim,Sori Lee,Hyewon Ryu,Heyn Kim,Zhenqiang Ma,Tae‐il Kim
标识
DOI:10.1002/adfm.201902575
摘要
Abstract Owing to the growing demand for highly integrated electronics, anisotropic heat dissipation of thermal management material is a challenging and promising technique. Moreover, to satisfy the needs for advancing flexible and stretchable electronic devices, maintaining high thermal conductivity during the deformation of electronic materials is at issue. Presented here is an effective assembly technique to realize a continuous array of boron nitride (BN) nanosheets on tetrahedral structures, creating 3D thermal paths for anisotropic dissipation integrated with deformable electronics. The tetrahedral structures, with a fancy wavy shaped cross‐section, guarantee flexibility and stretchability, without the degradation of thermal conductivity during the deformation of the composite film. The structured BN layer in the composites induces a high thermal conductivity of 1.15 W m −1 K −1 in the through‐plane and 11.05 W m −1 K −1 in the in‐plane direction at the low BN fraction of 16 wt%, which represent 145% and 83% increases over the randomly mixing method, respectively. Furthermore, this structured BN composite maintains thermal dissipation property with 50% strain of the original length of composite. Various electronic device demonstrations provide exceptional heat dissipation capabilities, including thin film silicon transistor and light‐emitting diode on flexible and stretchable composite, respectively.
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