Experimental and simulational investigation of wire bow deflection in single wire saw

Wire sawing is widely used for wafer cutting in the photovoltaic and microelectronics industries. The quality of cutting wafers is affected by the wire bow deflection. In this study, wire bow deflections in a crystal sawing process were systematically measured with a high-speed camera. A simulation model of wire bow deflection was established using the Adams software on the basis of experimental conditions. It is shown that the curve of the wire bow deflection was a quadratic curve. Wire bow deflection was obviously affected by the wire tension force and the feeding speed. However, wire speed had little effect on the wire bow deflection. The experimental and the simulation results of wire bow deflection were similar for different process parameters. The force ratio played a key role in influencing the wire bow deflection.