表征(材料科学)
电介质
材料科学
计算机科学
光电子学
纳米技术
作者
Vivek Chidambaram,Prayudi Lianto,Xiangyu Wang,Gilbert See,Nicholas Wiswell,Motoharu Kawano
标识
DOI:10.1109/ectc32696.2021.00078
摘要
Wide range of choices are available for dielectric materials selection for hybrid bonding, which include: thermal oxide, PECVD TEOS SiO 2 , SiN, SiCN and commercial polymer dielectrics. Among the polymer dielectrics, two types: high-temperature curable (350°C) and low-temperature curable (250°C) are investigated. Conclusion of bond strength characterization of different dielectric materials are as follows: Polymer > SiCN > TEOS SiO 2 > SiN. Bonding energy >2.5 J/m2 and die shear strength ≥ 50 MPa, which is higher than the Si yield strength could only be achieved through polymer dielectrics. Dielectric delamination during post-bond annealing for enhancing Cu-Cu diffusion bonding is a major challenge frequently encountered for SiO 2 dielectric. Peeling stress generation is the root cause for such delamination. It is confirmed that polymer dielectrics with low Young's Modulus will mitigate such peeling stress generation. However, polymer dielectrics too have their own challenges. Fine scratches generation during chemical-mechanical polishing (CMP) is yet to be fully resolved. SiCN is identified to be the ideal candidate from CMP perspective. Replacing Cu with Cu/Sn solder was also explored for catering low T hybrid process flow. Pros and Cons of different dielectric materials in the process integration of Cu/dielectric hybrid bonding are discussed.
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