BEOL N2: M2 through SAxP process from MP21 to MP26: 193i SAQP vs EUV SADP

193i SAQP has allowed industry for continued BEOL metal pitch scaling, but as metal pitches become even tighter EUV SADP becomes an interesting alternative. In this context we have explored within our dual damascene 3ML test vehicles how the EUV SADP process compares to 193i SAQP for printing MP21 M2 lines. Our first EUV SADP results already show a better wafer CDU compared to our POR 193i SAQP process.