微通道
微型热交换器
热交换器
制作
传热
铜
板翅式换热器
材料科学
板式换热器
热交换器中的铜
机械工程
冶金
工程类
机械
纳米技术
物理
医学
病理
替代医学
作者
Bin Lü,Ke Chen,W. J. Meng,Fanghua Mei
标识
DOI:10.1088/0960-1317/20/11/115002
摘要
Low-profile, Cu-based microchannel heat exchangers (MHEs) with different geometric dimensions were fabricated, bonded and assembled. A transient liquid phase (TLP) process was used for bonding of Cu-based MHEs with total thicknesses ranging from 600 µm to 1700 µm. The structural integrity of TLP-bonded Cu MHEs was examined. Device-level heat transfer testing was performed on a series of Cu-based MHEs to study the influence of microchannel dimensions on overall heat transfer performance, corroborated by computational results from a simple 2D finite element analysis. The present results demonstrate the promise of low-profile metallic MHEs for high heat flux cooling applications.
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