Instantaneous generation of many flaked particles caused by micro-arc discharge and detection method using load impedance monitoring system — Yuji Kasashima

In volume manufacture of LSI, particle contamination in plasma etching equipment is among the most serious problems [1]. The particles cause short circuit of LSI and significantly lower production yield. Mass-production equipment must be stopped for cleaning of etching chambers periodically, which gives rise to the reduction in overall equipment efficiency (OEE). Development of particle-free processes and equipment is crucially important to reduce production cost.