材料科学
钝化
感应耦合等离子体
制作
蚀刻(微加工)
等离子体
GSM演进的增强数据速率
干法蚀刻
等离子体刻蚀
光电子学
薄脆饼
分析化学(期刊)
化学
复合材料
图层(电子)
电信
医学
量子力学
物理
病理
色谱法
计算机科学
替代医学
作者
Quanbao Li,Xiaohui Ren,Jihong Zhang,Yushan Chi
出处
期刊:China Semiconductor Technology International Conference
日期:2021-03-14
标识
DOI:10.1109/cstic52283.2021.9461506
摘要
Si 3 N 4 etch control is one of the most critical processes for profile angle, uniformity and selectivity. We investigated the morphology and selectivity of Si 3 N 4 etch in inductively coupled plasmas (ICP) and capacitively-coupled plasmas (CCP), which are standardly used in fabrication industry for the etching process with Lam conductor etch (CE) Kiyo® series and dielectric etch (DE) Flex® series tool, respectively. In our study, Si 3 N 4 etching was performed by using CF 4 /CHF 3 based plasma and combining O 2 plasma to balance passivation when mixed with diluted gas AR or helium. We have focused on tuning ESC temperature, O 2 flow, total flow, gas ratio and power splits to improve profile angle and uniformity. In addition, the wafer edge tilting issue has also been optimized to improve extreme edge profile tilting process window in extreme edge area.
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