石墨烯
材料科学
复合数
热导率
空位缺陷
分子动力学
微观结构
极限抗拉强度
复合材料
石墨烯泡沫
声子
粉末冶金
基质(化学分析)
化学工程
纳米技术
氧化石墨烯纸
结晶学
凝聚态物理
计算化学
化学
工程类
物理
作者
Bo Hou,Pei Liu,Aiqin Wang,Jingpei Xie
标识
DOI:10.1016/j.jallcom.2021.163555
摘要
In the present work, we firstly used the first-principles calculation and molecular dynamics (MD) simulation to predict the graphene/Al interfacial properties, and it is found that graphene defect and Al alloying Cu(Mg) could be an effective method for enhancing the graphene/Al interfacial bonding strength and thermal conductance due to the pronounced hybridization and phonon-phonon coupling effect between interfacial Cu(Mg) atoms and C atoms near the vacancy. Then we successfully prepared the aligned graphene/2024Al composite with the optimized interfacial microstructure by the method of powder metallurgy. The results showed that the tensile strength of 0.5 wt% graphene/2024Al composite could reach 325 MPa and is ~38.3% higher than that of the 2024Al matrix, while the plasticity keeps almost unchanged. The thermal conductivity of 0.5 wt% graphene/2024Al composite is 16.3% (10.9%) higher than 2024Al matrix along (or vertical to) the aligned direction of graphene.
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