材料科学
合金
微观结构
位错
成核
透射电子显微镜
冶金
结晶学
再结晶(地质)
变形(气象学)
动态再结晶
复合材料
热加工
化学
纳米技术
地质学
古生物学
有机化学
作者
Bin Yang,Bai Xiong Liu,Bao Jun Han,Li Na Zhang,Ying Hui Zhang
出处
期刊:Advanced Materials Research
日期:2010-10-01
卷期号:146-147: 682-686
标识
DOI:10.4028/www.scientific.net/amr.146-147.682
摘要
The microstructure evolution of hot deformed Cu-Zn-Se-Bi-Sn alloy was investigated by Hitachi-800 transmission electron microscopy (TEM). The result shows that there are three different dislocation configurations such as dislocation network, dislocation wall and dislocation cell in hot deformed Cu-Zn-Se-Bi-Sn alloy. The dislocation network was firstly formed in some certain grains of Cu-Zn-Se-Bi-Sn alloy when the deformation strain amounted to 2%. Then dislocations initially arranged regularly beside original grain boundaries and the arranged dislocation walls were formed in some area and sub-grains merging emerged when the deformation strain amounted to 20%. Eventually, obvious dynamic recrystallization nucleation by sub-grain merging emerged in Cu-Zn-Se-Bi-Sn alloy when the strain attached 80%.
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