环氧树脂
绝缘栅双极晶体管
可靠性(半导体)
材料科学
可靠性工程
复合材料
电气工程
工程类
电压
功率(物理)
量子力学
物理
作者
Yu-Ju Chen,Hao-Chih Chen,Wei-Hao Chi,Hao-Chiang Hsu,Lu Ken-Cheng,Hsueh-Kuo Liao
标识
DOI:10.1109/impact47228.2019.9024973
摘要
Power module reliability becomes more and more important than before, especially in the next generation power device. Electric vehicle applications and high temperature operation need better lifetime and environmental resistance. The encapsulated materials should be improved for high temperature stability and high power density applications. Liquid epoxy compound is a new encapsulated material for power module applications. It influences many fields in the power module development, for examples, module design, assembly process, module characteristics, reliability...etc. This paper descripts the power module with liquid epoxy compound in assembly process, module characteristics, and reliability issues.
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