Epoxy Resin Encapsulated IGBT Module Characteristics and Reliability

Power module reliability becomes more and more important than before, especially in the next generation power device. Electric vehicle applications and high temperature operation need better lifetime and environmental resistance. The encapsulated materials should be improved for high temperature stability and high power density applications. Liquid epoxy compound is a new encapsulated material for power module applications. It influences many fields in the power module development, for examples, module design, assembly process, module characteristics, reliability...etc. This paper descripts the power module with liquid epoxy compound in assembly process, module characteristics, and reliability issues.