烧结
材料科学
收缩率
多孔性
停留时间
复合材料
粒径
相对密度
粒子(生态学)
阿累尼乌斯方程
活化能
化学工程
有机化学
工程类
化学
地质学
海洋学
医学
临床心理学
作者
Jiajie Fan,Dan Xu,Hao Zhang,Cheng Qian,Xuejun Fan,Guoqi Zhang
出处
期刊:IEEE Transactions on Components, Packaging and Manufacturing Technology
[Institute of Electrical and Electronics Engineers]
日期:2020-07-01
卷期号:10 (7): 1101-1109
被引量:11
标识
DOI:10.1109/tcpmt.2020.2995634
摘要
Better mechanical, thermal properties and longer lifetimes are needed for the die attach layer in high-power electronic packaging. As traditional Sn-Ag-Cu (SAC) solders have many limitations, the sintered nanosilver materials are becoming one of the substitutes for high-power electronic packaging. However, the high performance of sintered nanosilver materials is only achieved when its fine sintering densification is formed. This article investigates the sintering densification process of nanosilver particles based on the design of orthogonal experiments and sintering kinetics modeling in which both the macroproperties and micromorphology are linked and analyzed. The results lead to several conclusions, such as: 1) the orthogonal experiments consider the effects of sintering temperature, dwell time, and sample preparation pressure on the sintering relative shrinkage and relative density-the results show that the most critical impact factor on sintering densification is the sintering temperature. (2) In the sintering kinetic experiments, the sintering densification rates obtained by fitting the relative density versus dwell time curves during 175 °C-250 °C follow the Arrhenius model, and the apparent activation energy of sintering kinetics is calculated to be 36 kJ/mol, while it is calculated from the particle size is 38.1 kJ/mol. 3) Through modeling the relationship between particle size, line shrinkage, and porosity, the line shrinkage and porosity first increase at the initial stage, while the particle size increases, and the macroscopic volume decreases at the end of sintering, the porosity decreases.
科研通智能强力驱动
Strongly Powered by AbleSci AI