Transfer Printing of Metallic Microstructures on Adhesion‐Promoting Hydrogel Substrates

Fabrication schemes that integrate inorganic microstructures with hydrogel substrates are essential for advancing flexible electronics. A transfer printing process that is made possible through the design and synthesis of adhesion-promoting hydrogels as target substrates is reported. This fabrication technique may advance ultracompliant electronics by melding microfabricated structures with swollen hydrogel substrates. As a service to our authors and readers, this journal provides supporting information supplied by the authors. Such materials are peer reviewed and may be re-organized for online delivery, but are not copy-edited or typeset. Technical support issues arising from supporting information (other than missing files) should be addressed to the authors. Please note: The publisher is not responsible for the content or functionality of any supporting information supplied by the authors. Any queries (other than missing content) should be directed to the corresponding author for the article.