可靠性工程
可靠性(半导体)
动力循环
依赖关系(UML)
电子元件
汽车工业
绝缘栅双极晶体管
数码产品
功率(物理)
计算机科学
产品(数学)
工程类
机械工程
电气工程
系统工程
电压
几何学
航空航天工程
物理
量子力学
数学
作者
Alexander Otto,Sven Rzepka
摘要
Lifetime modelling of electronic components and systems represents an important pillar of reliability research. Its main objective is the achievement of an accurate lifetime prediction for a given product or technology well before product release in order to assure the intended functionality for a given application scenario and time period. As baseline, extensive lifetime tests are necessary to investigate the dependency of the lifetime on various influencing factors occurring during operation. This paper will focus on the development of lifetime models for discrete power electronic devices based on power cycling tests. In contrast to existing lifetime models for standard IGBT based modules, the achieved results show that in case of transfer molded packages the glass transition temperature Tg needs to be taken into account.
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