Automated Multidisciplinary Analysis And Lab Verification for Silicon-Carbide Based Power Modules

Electric-thermal modelling and simulation of power electronics modules is critical, yet time consuming and error prone task. Automation of modelling and simulation tasks helps reduce simulation time while producing reliable and consistent results. A web-based tool, MFIT, has been previously developed to cover the power module modelling and simulation process. MFIT starts with an existing 2D drawing of the module DBC (Direct Bond Copper) substrate and leadframe constructs. The user then places power dies from a preexisting die database. Bond wire and clip modelling is subsequently executed. External input out signal pins and power terminal modelling are also supported. The 2D is automatically translated into a 3D solid model through Ansys SpaceClaim® scripting. Next, transient thermal simulations using Ansys Icepak® and power module RLC parasitics extraction through Ansys Q3D Extractor® are conducted in batch mode to get thermal network and parasitic SPICE models. This paper advances the state of the art through a transition in MFIT to a reference-based 3D modelling approach and arbitrary clip design tool both of which enable modeling of truly arbitrary power module constructs. The obtained results have been validated across onsemi SiC MOSFET industrial power module.