Thermally conductive and electrically insulative alumina/epoxy composites for advanced electronic packaging applications: A comprehensive review of filler morphologies and surface modifications
材料科学
填料(材料)
复合材料
环氧树脂
导电体
导电的
电子包装
作者
Zihao Lin,Zhijian Sun,Wenbin Fu,Y.C. Lin,Kyoung‐sik Moon,C.P. Wong