正交异性材料
有限元法
倒装芯片
材料科学
收缩率
中间层
参数统计
制作
机械工程
材料性能
环氧树脂
粘弹性
结构工程
复合材料
工程类
胶粘剂
图层(电子)
病理
统计
蚀刻(微加工)
医学
替代医学
数学
作者
Hsien‐Chie Cheng,Ling-Ching Tai,Yancheng Liu
出处
期刊:Materials
[MDPI AG]
日期:2021-08-25
卷期号:14 (17): 4816-4816
被引量:10
摘要
This study attempts to investigate the warpage behavior of a flip chip package-on-package (FCPoP) assembly during fabrication process. A process simulation framework that integrates thermal and mechanical finite element analysis (FEA), effective modeling and ANSYS element death-birth technique is introduced for effectively predicting the process-induced warpage. The mechanical FEA takes into account the viscoelastic behavior and cure shrinkage of the epoxy molding compound. In order to enhance the computational and modeling efficiency and retain the prediction accuracy at the same time, this study proposes a novel effective approach that combines the trace mapping method, rule of mixture and FEA to estimate the effective orthotropic elastic properties of the coreless substrate and core interposer. The study begins with experimental measurement of the temperature-dependent elastic and viscoelastic properties of the components in the assembly, followed by the prediction of the effective elastic properties of the orthotropic interposer and substrate. The predicted effective results are compared against the results of the ROM/analytical estimate and the FEA-based effective approach. Moreover, the warpages obtained from the proposed process simulation framework are validated by the in-line measurement data, and good agreement is presented. Finally, key factors that may influence process-induced warpage are examined via parametric analysis.
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