Understanding the origin of Tabula Rasa-induced defects in n-type Cz c-Si: The case of nitrogen atmosphere

薄脆饼 载流子寿命 材料科学 空位缺陷 太阳能电池 兴奋剂 化学 光电子学 制作 降级(电信) 分析化学(期刊) 结晶学 电子工程 有机化学 替代医学 病理 工程类 医学 色谱法
作者
Jorge Ochoa,Vincenzo LaSalvia,Paul Stradins,Mariana I. Bertoni
出处
期刊:Solar Energy Materials and Solar Cells [Elsevier BV]
卷期号:252: 112159-112159 被引量:2
标识
DOI:10.1016/j.solmat.2022.112159
摘要

Phosphorus-doped Czochralski-grown silicon (Cz-Si) has been gaining market share in the large-scale manufacturing of high-efficiency silicon (Si)-based photovoltaic (PV) devices thanks to higher carrier lifetimes than their boron-doped counterpart. However, the fabrication of n-type Cz-Si based solar cells often requires process steps with much higher temperatures and longer times than p-type Silicon. Defect interaction with the high temperatures during such processes tend to be detrimental to the n-type Cz-Si carrier lifetime, therefore limiting the final device efficiency. Short thermal anneals before cell processing, known as Tabula Rasa (TR), have been proposed to mitigate the thermally induced lifetime degradation during n-type Cz-Si solar cell fabrication. This work thoroughly investigates the defects responsible for the lifetime degradation after TR in a N2 atmosphere treatment. We use temperature-injection-dependent lifetime spectroscopy and the thickness variation method to decouple the effects of TR treatment in the bulk and the surface of the n-type Cz-Si wafers. Using the defect parameter contour mapping (DPCM), we identify the defect energy level (Et) and the capture cross-section ratio (k) of the most likely process-induced defect, which aligns with previously proposed Si vacancy-associated defects. The DPCM reveals that these vacancy-associated defects have a shallow energy level Et − Ev ∼0.13 eV and very efficient electron capture cross section k∼600. Unexpectedly, the bulk degradation due to vacancy defects in the volume of the wafer, is accompanied by a significant increase in the surface recombination as well. Through evaluating the surface recombination velocity temperature- and injection dependence, we show that after TR, at room temperature and for an injection level of 1015 cm−3, in a wafer passivated with a-Si:H(i) the surface recombination dominates the overall lifetime response. We hypothesize that the near surface vacancy-associated bulk defects play a role in lowering the electron diffusion current into the a-Si:H(i) from the c-Si(n) reducing the field-effect passivation.
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