Design and Performance Study of Double-layer Cross-flow Microchannel Liquid-cooled plate

Abstract Indirect liquid cooling is one of the important methods for high-performance electronic chip cooling. This study, focusing on the microchannel liquid-cooled plate technology, designed a two-layer cross-flow microchannel liquid-cooled plate. We conducted numerical simulations of the performance of liquid cooling plates under different Re conditions. The results show that the variable inlet flow channel design can lead to uniform fluid flow distribution. The smaller aspect ratio liquid cooling plate has higher average convective heat transfer coefficients at low Re. The liquid cooling plates with K values (aspect ratio) of 2 and 3 have better heat transfer capability at low Re, while the liquid cooling plate with K=3 performs better at high Re. Based on comprehensive performance analysis, a prototype was made for experiments, and the experimental results show that increasing the flow velocity can reduce the temperature of the liquid cooling plate and improve the cooling efficiency. However, when the flow velocity of the cooling medium exceeds 0.5 m/s, it limits the improvement of the cooling performance of the liquid cooling plate. As the flow velocity rises, there is a corresponding increase in flow resistance, the differential pressure across the cold plate is experiencing a slight acceleration in its rate of change. By analyzing the experimental data, a correlation equation on Nu was established, and a comparison of the experimental Nu and the calculated Nu shows that the established correlation equation has high accuracy and predictability.