Thermal stable honokiol-derived epoxy resin with reinforced thermal conductivity, dielectric properties and flame resistance

To produce renewable and functional epoxy resins, novel polymers were fabricated based on naturally available honokiol. The honokiol-derived (DBDBBB) epoxy resin monomer was firstly reported and cured by diamino diphenyl-sulfone (33DDS and 44DDS). The resultant networks were fabricated via both epoxy resin and polyolefin, and showed excellent thermal stability (Tmax up to 451 °C), thermal conductivity (~0.743 W/m•K), and high specific heat (5.364 J/g•K) as well as the excellent dielectric constant and loss values (9.74, 0.026) (1 kHz, 25 °C). Moreover, the bio-based networks were low flammable. The high-performing DBDBBB/DDS networks surpass the DGEBA analogs, and hence it will be a promising candidate for DGEBA and has great potential application in the electronics and microelectronics industry.