原子单位
平版印刷术
纳米技术
吞吐量
极端紫外线
抵抗
材料科学
极紫外光刻
蚀刻(微加工)
原子力显微镜
纳米光刻
光子学
计算机科学
光电子学
激光器
物理
制作
光学
图层(电子)
医学
电信
替代医学
量子力学
病理
无线
作者
H.Y. Hafeez,Wenkun Xie,Xichun Luo
标识
DOI:10.1109/icac57885.2023.10275165
摘要
Next-generation lithography techniques such as Extreme Ultraviolet Lithography have started to reach their physical limits and will not be able to meet the requirements of future Post-Moore Era Integrated Circuit chips that will be based on quantum, photonic, and DNA computing. These future chips and the next generation of quantum products will require sub-10nm and even atomic-scale functional features. Promising candidates for atomic and close-to-atomic scale manufacturing include well-established tip-based techniques such as Scanning Tunnelling Microscopy (STM) and Atomic Force Microscopy (AFM), however, they suffer from severely low throughput, although parallel tips have been suggested to increase the throughput. The integration of these techniques with others such as AFM in Scanning Electron Microscopy has created new hybrid techniques that have greatly enhanced the capabilities of the standalone process. On the other hand, higher throughput techniques like atomic layer etching (ALE) suffer from poor process control and defects despite being promising candidates due to the self-limiting nature of the processes. Studies into laser processing techniques are being investigated to test the feasibility of laser beam-based atomic scale precision manufacturing. Furthermore, the recent progress in quantum simulations has promoted the development of the optical tweezer towards atomic scale manufacturing.
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