Coaxial electrospinning fabrication of core-shell energetic fibers and in-situ integration with SCB exhibiting superior non-contact ignition

• The core-shell energetic fibers are designed and fabricated through the coaxial electrospinning. • The combustion characteristics of core-shell energetic fibers increase by the increase of CL-20. • CSEF 50C films are deposited onto SCB in-situ displaying an excellent clearance ignition ability. Electrospinning has exhibited great potential in the fabrication of fibrous energetic materials for the past few years. Herein, the core-shell energetic fibers (defined as CSEF) were designed and fabricated through the coaxial electrospinning. The core stratum was Al/MoO 3 -PVDF and the shell stratum was CL-20-NC. The morphologies of CSEF performed a clear core-shell structure, and the constituent analyses demonstrated that the components did not change after the preparation. According to the relative content of CL-20, the samples were defined as CSEF 0C , CSEF 10C , CSEF 30C and CSEF 50C respectively. The clear core-shell structure of CSEF was confirmed through the morphologies. The total heat releases of CSEF were not affected by the variation of the content of CL-20 nearly, and the existence of CL-20 improved the thermal stability of Al/PVDF. The combustion propagation velocity of CSEF increased by the increase of CL-20 from 0.241 m/s (CSEF 0C ) to 0.664 m/s (CSEF 50C ). In addition, CL-20 decreased the ignition temperature and delay time of CSEF. The combustion products analyses demonstrated that CL-20 promoted the combustion performance of CSEF by leading to less sintering of the reactants. Furthermore, CSEF 50C films were fabricated and deposited onto a semiconductor bridge (SCB) in-situ (defined as CSEF 50C -SCB). CSEF 50C -SCB possessed larger flame and longer combustion duration, which displayed an excellent clearance ignition ability. The superior combustion performance of CSEF films assembled with SCB in-situ would exhibit the admirable application prospects for practice when combined the Micro-electromechanical systems (MEMS).