计量学
像素
材料科学
光学
转印
传输(计算)
过程(计算)
单发
计算机科学
物理
并行计算
复合材料
操作系统
作者
Eleni Margariti,Gemma Quinn,Dimitars Jevtics,Benoit Guilhabert,Martin D. Dawson,Michael J. Strain
摘要
A continuous, single shot roller transfer printing process is presented for the large-scale hybrid integration of semiconductor devices. Transfer of a 320 × 240 pixel micro-LED array, representing >75,000 individual devices in a single shot with sub-micron relative position accuracy is demonstrated. The transfer printing process preserves the array geometry with pixel spatial location error less than 1 µm deviation from the as-designed layout. An automated sub-micron precision metrology system based on simple optical microscopy was developed to asses such large device populations and allow the assessment of yield.
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