材料科学
前角
金刚石车削
表面粗糙度
硅
脆性
半径
GSM演进的增强数据速率
刀具磨损
复合材料
机械工程
机械加工
光电子学
冶金
计算机科学
工程类
计算机安全
电信
作者
Yan Zhou,Yan Gu,Jian Lin,Yanping Zheng,Weidong Zhou,Huibo Zhao,Ru Feng Jia,Shuang Wu
标识
DOI:10.1016/j.jmrt.2021.12.095
摘要
Due to the material properties of single-crystal silicon, it is difficult to achieve high-efficiency processing in conventional turning. Fast tool servo (FTS) turning has emerged as a favorable technology for processing brittle materials. This paper investigates the tool radius, feed speed, and cutting depth effects on the maximum undeformed chip thickness (MUCT). A high-frequency low-coupling FTS system is designed for processing experiments. Effects of the tool rake angle, tool radius, cutting speed, and vibration frequency on the critical undeformed chip thickness (CUCT) are explored in this paper. Experimental results indicate FTS technology can increase the CUCT from 80 nm to 580 nm. Surface and subsurface morphology tests of conventional and FTS single-crystal silicon cutting verify that FTS technology can obtain an optical surface roughness of 5 nm and lower subsurface damage. Moreover, FTS turning can reduce tool wear. Lastly, through Raman spectroscopy analysis, the amorphous phase remaining on the machined surface is lower when FTS turning is employed.
科研通智能强力驱动
Strongly Powered by AbleSci AI