光电子学
材料科学
集成电路
光子晶体
电子线路
绝缘体上的硅
波导管
制作
混合硅激光器
作者
Joan Manel Ramirez,Hajar Elfaiki,Theo Verolet,Claire Besancon,Antonin Gallet,Delphine Néel,Karim Hassan,Segolene Olivier,Christophe Jany,Stephane Malhouitre,Kamil Gradkowski,Padraic E. Morrissey,Peter O'Brien,Christophe Caillaud,Nicolas Vaissiere,Jean Decobert,Shenghui Lei,Ryan Enright,Alexandre Shen,Mohand Achouche
标识
DOI:10.1109/jstqe.2019.2939503
摘要
Heterogeneous integration of III-V materials onto silicon photonics has experienced enormous progress in the last few years, setting the groundwork for the implementation of complex on-chip optical systems that go beyond single device performance. Recent advances on the field are expected to impact the next generation of optical communications to attain low power, high efficiency and portable solutions. To accomplish this aim, intense research on hybrid lasers, modulators and photodetectors is being done to implement optical modules and photonic integrated networks with specifications that match the market demands. Similarly, important advances on packaging and thermal management of hybrid photonic integrated circuits (PICs) are currently in progress. In this paper, we report our latest results on hybrid III-V on Si transmitters, receivers and packaged optical modules for high-speed optical communications. In addition, a review of recent advances in this field will be provided for benchmarking purposes.
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