材料科学
复合材料
化学气相渗透
电介质
结构材料
抗弯强度
微观结构
陶瓷基复合材料
断裂韧性
陶瓷
光电子学
作者
Chaokun Song,Yongsheng Liu,Fang Ye,Laifei Cheng,Pengfei Zhang,Nan Chai
标识
DOI:10.1007/s40145-021-0470-5
摘要
Abstract The SiBCN matrix via chemical vapor infiltration (CVI) or/and polymer infiltration pyrolysis (PIP) technologies was orderly introduced to SiC f /SiC composites to optimize the mechanical property and electromagnetic (EM) shielding effectiveness simultaneously. The BN interface with the thickness of 350 nm was designed to obtain a little stronger interface bonding. The flexural strength of SiC f /SiC-SiBCN composites reached 545.45±29.59 MPa thanks to the crack deflection between the CVI SiC and CVI SiBCN, as well as CVI SiBCN and PIP SiBCN matrix because of the modulus difference between them. The fracture toughness ( K IC ) with the value of 16.02±0.94 MPa·m 1/2 was obtained owing to the extension of crack propagation path. The adverse effect of stronger interface bonding was eliminated by the design of matrix microstructure for SiC f /SiC-SiBCN composites. The thermal conductivity in the thickness direction was 7.64 W·(m·K) −1 at 1200 °C and the electric resistivity decreased to 1.53×10 3 Ω·m. The tunable dielectric property was obtained with the coordination of wave-absorption CVI SiBCN matrix and impedance matching PIP SiBCN matrix, and the total shielding effectiveness ( SE T ) attained 30.01 dB. It indicates that the SiC f /SiC-SiBCN composites have great potential to be applied as structural and functional materials.
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