高电子迁移率晶体管
材料科学
光电子学
散热片
氮化镓
电压
可靠性(半导体)
温度测量
饱和(图论)
功率(物理)
电气工程
晶体管
复合材料
图层(电子)
物理
数学
量子力学
组合数学
工程类
作者
M. Florovič,Róbert Szobolovszký,Jaroslav Kováč,Jaroslav Kováč,Aleš Chvála,Jean-Claude Jacquet,S.L. Delage
出处
期刊:Journal of Electrical Engineering
[De Gruyter]
日期:2018-09-01
卷期号:69 (5): 390-394
标识
DOI:10.2478/jee-2018-0057
摘要
Abstract GaN-based HEMTs’ high potential is deteriorated by self-heating during the operation, this has influence on the electrical properties as well as device reliability. This work is focused on an average channel temperature determination of power AlGaN/GaN HEMT prepared on SiC substrate using quasi-static and pulsed I-V characterization. There was analyzed the drain current change relation to temperature dependent electrical HEMT parameters such as source resistance, threshold voltage, saturation velocity, resp. leakage current which allows to calculate an average channel temperature versus dissipated power for various ambient temperature. Differential temperature of investigated device with and without heatsink was determined. Obtained results were discussed using simulated spatial temperature distribution.
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