抗性(生态学)
生化工程
计算机科学
工程类
生物
生态学
作者
Weiwei Liu,Fan Zhang,Lihong Dong,Haidou Wang,Zhonghui An,Guoqing Zhang
标识
DOI:10.1177/09544062251326806
摘要
Thermal resistance model (TRM) is important analytical tool in the field of heat transfer, so it is essential to understanding its theories, models, and engineering applications for thermal analysis and design utilizing TRMs. In this paper, the research status quo of TRM is comprehensively illustrated. In terms of theory, the macro and micro theoretical basis of thermal resistance are reviewed, and the research progresses of the theories of thermal contact resistance, interfacial thermal resistance and novel thermal resistance are introduced. In terms of model, the existing TRMs and relative methodologies are summarized by classification as: geometry and structure class, dynamics class and interfacial contact class and the characteristics and the scope of application of various models are clarified while the basic challenges in the development of TRM have also been summed up. In terms of engineering application where the research objectives of TRM are firstly combed up and from three categories, microelectronics, industrial heat exchanger equipment, and materials are sequentially elaborated on the grounds of TRM applications, where the hotspots and difficulties in each part are also discussed. In conclusion, the possible opportunities of TRMs for future research are pointed out.
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