材料科学
微观结构
电子背散射衍射
合金
扫描电子显微镜
压痕硬度
固溶强化
晶体孪晶
材料的强化机理
透射电子显微镜
冶金
烧结
高熵合金
粒度
复合材料
纳米技术
作者
Xi Wang,Haodong Tian,Yuzhen Yu,Shuangyu Liu,He Liu,Ben Wang,Hanpeng Gao
标识
DOI:10.1016/j.jmrt.2024.01.144
摘要
Herein, laser remelting (LR) and hot press sintering (HPS) were combined to process high-entropy alloy (HEA) and strengthen desirable microstructure. The microstructural changes of HEA before and after LR processing were experimentally investigated. In Scanning Electron Microscope (SEM) and electron backscatter diffraction (EBSD) observations, it was found that the microstructure of the remelting zone was mainly composed of dendritic isometric crystals, and the laser remelting technique can refine the grain structure of HEA. The combined strengthening features of dislocations and twinning were observed by Transmission electron microscopy (TEM), and the phase structure of the grains was analyzed in conjunction with the X-ray diffraction(XRD) analysis, confirming the presence of B2 with BCC solid-solution and FCC phase. Finally, micron-sized scratches, tensile experiments and microhardness experiments were performed, and it was found that the Mechanical properties of the remelting zone were significantly enhanced. It was demonstrated that the strengthening of HEA, sintered by LR and HPS techniques, is due to the synergistic influence of various strengthening mechanisms, such as fine grain strengthening, dislocation strengthening, solid-solution strengthening and twinning strengthening.
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