Hybrid Dielectric Thin Films on Flexible Substrates for Embedded Capacitor Applications

This paper describes a novel fabrication process and technology for making hybrid thin film capacitors on flexible metallic substrates using vapor deposition process (polymer multilayer) and RF sputtering. In this case, polymeric acrylate thin films are deposited on flexible base metal foils (Cu) using a vapor deposition process followed by inorganic yttria stabilized zirconia thin films by RF sputtering for embedded capacitor and energy storage applications. This hybrid thin film approach exhibits a high yield of functional capacitors with high capacitance density values, low dielectric loss, and excellent insulating properties. This technique provides a huge improvement in the device yield and does not require sophisticated deposition equipment or a clean room environment or any kind of surface cleaning treatment of substrates and can potentially be adopted in a roll-to-roll industrial manufacturing process.